Publications – RESOLAB

2023

C.-P. Tsai and W.-C. Li, “Micromechanical Vibro-Impact Systems: A Review,” J. Micromech. Microeng. (JMM), vol. 33, no. 9, pp. 093001, Aug., 2023.
C.-P. Tsai and W.-C. Li, “Vibro-Impact Perturbation Based Attractor Exchanger for Open-Loop Nonlinear Resonators,” in the 22nd Int. Conf. on Solid-State Sensors & Actuators (TRANSDUCERS’23), Kyoto, Japan, Jun. 25-29, 2023. (Oral Presentation)
T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “Constructing Micromechanical Frequency Combs in Bifcating Attractor Branches for Event Triggered Sensors,” in the 22nd Int. Conf. on Solid-State Sensors & Actuators (TRANSDUCERS’23), Kyoto, Japan, Jun. 25-29, 2023. (Oral Presentation)
Y. Yi, C.-P. Tsai, and W.-C. Li, “Sensitivity enhancement for micromechanical vibro-impact resonators using snap-through curved beams,” Micro Nano Lett., vol. 18, no. 1, pp. 1-6, Jan. 2023.
C.-P. Tsai and W.-C. Li, “Attractor Exchanger for Open-Loop Operation of Micromechanical Nonlinear Resonators Using Gap-Spacing Continuation,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023. (Oral Presentation).
T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “A CMOS-MEMS Ultrasensitive Thermometer Using Internal Resonance Induced Frequency Combs,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023. (Oral Presentation).
T.-Y. Chen and W.-C. Li, “A CMOS-MEMS Beam Resonator with Q > 10,000,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023.
T.-J. Liou, C.-P. Tsai, T.-Y. Chen, and W.-C. Li, “Towards a Better CMOS-MEMS Resoswitch Using Electroless Plating for Contact Engineering,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023.
I.-C. Hsieh, H.-S. Zheng, C.-P. Tsai, T.-Y. Chen, and W.-C. Li, “Generic Temperature Compensation Scheme for CMOS-MEMS Resonators Based on Arc-Beam Derived Electrical Stiffness Frequency Pulling,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023.
Y.-H. Huang, H.-S. Zheng, C.-P. Tsai, and W.-C. Li, “Micromechanical RSSI Based on Force Interaction Derived Tapping Bandwidth Variation in Vibro-Impact Resonators,” in the 36th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’23), Munich, Germany, Jun. 15-19, 2023.

2022

C.-P. Tsai and W.-C. Li, “CMOS-MEMS Vibro-Impact Devices and Applications,” Front. Mech. Eng., vol. 08, p.898328, Jun. 2022.
C.-P. Tsai and W.-C. Li, “A Micromechanical Frequency Controlled Pulse Density Modulator,” in the 35th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’22), Tokyo, Japan (Hybrid Event), Jun. 9-13, 2022. (Oral Presentation).
H.-S. Zheng, C.-P. Tsai, T.-Y. Chen, and W.-C. Li, “CMOS-MEMS Resonators with sub-100-nm Transducer Gap Using Stress Engineering,” in the 35th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’22), Tokyo, Japan (Hybrid Event), Jun. 9-13, 2022. (Oral Presentation).
T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “1:6 Internal Resonance in CMOS-MEMS Multiple-Stepped CC-Beam Resonators,” in the 35th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’22), Tokyo, Japan (Hybrid Event), Jun. 9-13, 2022. (Oral Presentation).
P.-C. Huang, T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “An Ultrasensitive CMOS-MEMS Tuned-Mass-Damper (TMD) Based Voltmeter,” in the 35th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’22), Tokyo, Japan (Hybrid Event), Jun. 9-13, 2022.

2021

W.-C. Li, “Micromechanical Vibro-Impact Resonator-Enabled Sensing Applications,” in the 21st Int. Conf. on Solid-State Sensors & Actuators (TRANSDUCERS’21), Virtual Conference, Jun. 20-25, 2021. (Invited)
C.-P. Tsai, H.-W. Wang, and W.-C. Li, “Tapping Bandwidth Widening of CMOS-MEMS Vibro-Impacting Resonators Based on Double-Sided Stopper Structure,” in the 21st Int. Conf. on Solid-State Sensors & Actuators (TRANSDUCERS’21), Virtual Conference, Jun. 20-25, 2021.
J.-R. Liu, C.-P. Tsai, W.-R. Du, T.-Y. Chen, J.-S. Chen, and W.-C. Li, “Vibration Mode Suppression in Micromechanical Resonators Using Embedded Anti-Resonating Structures,” IEEE J. Microelectromech. Syst. (JMEMS), vol. 30, no. 1, pp. 53-63, Feb. 2021.
C.-E. Hsu and W.-C. Li, “Enhancing the Release Process Yield for CMOS-MEMS Metal Resonators Based on Diffusion-Controlling Structures,” Proc., 34th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’21), Virtual Conference, Jan. 25-29, 2021.

2020

C.-E. Hsu and W.-C. Li, “Mitigating the Insufficient Etching Selectivity in the Wet Release Process of CMOS-MEMS Metal Resonators via Diffusion Control,” IEEE J. Microelectromech. Syst. Lett. (JMEMS Letters), vol. 29, no. 6, pp. 1415-1417, Dec. 2020. (Highlighted as JMEMS RightNow Paper)
C.-P. Tsai, J.-R. Liu, and W.-C. Li, “Experimental Study on Frequency Stability of Micromechanical Resonators Operating in the Nonlinear Tapping Mode,” Proc., 2020 IEEE Int. Frequency Control Symposium (IFCS’20), Virtual Conference, July 19-23, 2020.
W.-J. Su, J.-H. Lin, and W.-C. Li, “Analysis of a Cantilevered Piezoelectric Energy Harvester in Different Orientations for Rotational Motion,” Sensors, vol. 20, no. 4, p. 1206, Feb. 2020.
C.-P. Tsai, Y.-Y. Liao, and W.-C. Li, “A 125-kHz CMOS-MEMS Resoswitch Embedded Zero Quiescent Power OOK/FSK Receiver,” Proc., 33rd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’20), Vancouver, Canada, Jan. 18-22, 2020. (Oral Presentation)

2019

Y.-H. Chen, W.-C. Li, X.-W. Xiao, C,-C. Yang, and C.-H. Liu, “Design Optimization of a Compact Double-Ended-Tuning-Fork-Based Resonant Accelerometer for Smart Spindle Applications,” Micromachines, vol. 11, no. 1, p. 42, Dec. 2019.
J.-R. Liu and W.-C. Li, “Temperature-compensated CMOS-MEMS resonators via electrical stiffness frequency pulling,” J. Micromech. Microeng. (JMM), vol. 30, no. 1, pp. 014002, Nov. 2019. (in the special issue of JMM Emerging Leaders)
J.-S. Chen, W.-J. Su, Y. Cheng, W.-C. Li and C.-Y. Lin, “A metamaterial structure capable of wave attenuation and concurrent energy harvesting,” Journal of Intelligent Material Systems and Structures, vol. 30, issue 20, pp. 2973-2981, Dec. 2019.
J.-R. Liu and W.-C. Li, “A Temperature-Insensitive CMOS-MEMS Resonator Utilizing Electrical Stiffness Compensation,” Proc., 32nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’19), Seoul, South Korea, Jan. 27-31, 2019, pp. 161-164. (Oral Presentation)
J.-R. Liu, Y.-C. Lo, and W.-C. Li, “A Novel Micromechanical Mode-Localized Resonator Utilizing Anti-Resonating Structures,” Proc., 32nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’19), Seoul, South Korea, Jan. 27-31, 2019, pp. 214-217. (Oral Presentation)

2018

S.-C. Lu, C.-P. Tsai, Y.-C. Huang, W.-R. Du, and W.-C. Li, “Surface Condition Influence on the Nonlinear Response of MEMS CC-Beam Resoswitches,” IEEE Electron Device Letters (EDL), vol. 39, no. 10, pp. 1600-1603, Oct. 2018.
S.-C. Lu, W.-R. Du, Y.-C. Huang, C.-P. Tsai, and W.-C. Li, “MEMS surface coating condition monitoring via nonlinear tapping of resoswitches,” Proc., 2018 IEEE Int. Frequency Control Symposium (IFCS’18), Olympic Valley, CA, May 21-24, 2018. (Student Best Paper Finalist)
J.-R. Liu, S.-C. Lu, C.-P. Tsai, and W.-C. Li, “A CMOS-MEMS clamped–clamped beam displacement amplifier for resonant switch applications,” J. Micromech. Microeng. (JMM), vol. 28, no. 6, pp. 065001, Mar. 2018.
S.-C. Lu, C.-P. Tsai, and W.-C. Li, “A CMOS-MEMS CC-beam metal resoswitch for zero quiescent power receiver applications,” Proc., 31st IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’18), Belfast, North Ireland, UK, Jan. 21-25, 2018, pp. 801-804.

Domestic Conference

C.-P. Tsai and W.-C. Li, “Parametric Study on the Contact Force of MEMS Resoswitches,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022. (Distinguished Oral Paper Award)
I-C. Hsieh and W.-C. Li, “Highly-Sensitive Temperature Sensors Based on Frequency Beating in CMOS-MEMS Resonators,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022. (Distinguished Oral Paper Award)
T.-Y. Chen and W.-C. Li, “Helmholtz Resonator Based Acoustic Filter Front-End,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022.
P.-C. Huang and W.-C. Li, “CMOS-MEMS Tuned-Mass-Damper (TMD) Embedded Voltmeters,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022.
T.-J. Liou and W.-C. Li, “Process Development for CMOS-MEMS Based TiN Resoswitches,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022.
Y.-H. Huang and W.-C. Li, “Constructive Utilization of Nonlinearity for Increasing Operating Bandwidth of Micromechanical Resoswitches,” in the ICSS 2022 International Conference on Smart Sensors (暨第27屆台灣化學感測器科技研討會/第25屆微奈米系統工程研討會), NCHU, Taichung, Oct. 22-23. 2022.
T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “An Achievement of CMOS-MEMS Temperature Sensor with Ultra High Sensitivity Based on Internal Resonance”, the 2nd Symposium on Nano-Device Circuits and Technologies (SNDCT 2022), Online, May 19-20, 2022. (學生論文競賽入圍)
T.-Y. Chen, C.-P. Tsai, and W.-C. Li, “Study on High-Order Internal Resonance of a Non-Uniform CMOS-MEMS CC-Beam Resonator,” 第18屆自動化科技國際研討會暨109年自動化學門成果發表會 (Automation 2021), Kinmen, Nov. 11-14, 2021. (學生論文競賽金牌獎)
Y. Yi, H.-S. Zheng, and W.-C. Li, “Vibro-Impact Read-Out Scheme for Micromechanical Memory. the ICSS 2021 International Conference on Smart Sensors,” in the ICSS 2021 International Conference on Smart Sensors (暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), NTU, Taipei, Oct. 14-15, 2021. (Honorable Award)
C.-P. Tsai and W.-C. Li, “Numerical Investigations of Bifurcation Phenomenon and Motion Behavior for Single-Sided Vibro-Impacting Resonators,” in the ICSS 2021 International Conference on Smart Sensors (暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), NTU, Taipei, Oct. 14-15, 2021.
H.-S. Zheng, D.-Y. Wu, and W.-C. Li, “A Negative- Capacitance Equivalent Circuit Model for Micromechanical Clamped-Clamped Beam Resonators,” in the ICSS 2021 International Conference on Smart Sensors (暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), NTU, Taipei, Oct. 14-15, 2021.
T.-Y. Chen and W.-C Li, “Modeling of CMOS-MEMS Multiple-Stepped CC-Beam Resonators Using Adomian Decomposition Method,” in the ICSS 2021 International Conference on Smart Sensors (暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), NTU, Taipei, Oct. 14-15, 2021.
Y.-S. Lin, C.-H. Kuo, P.-Z. Chang, and W.-C. Li, “Piezoelectric Cutting Force Sensor for Turning Tools Based on a Through- Screw Via,” in the ICSS 2021 International Conference on Smart Sensors (暨第26屆台灣化學感測器科技研討會/第24屆微奈米系統工程研討會), NTU, Taipei, Oct. 14-15, 2021.
C.-P. Tsai and W.-C. Li, “Experimental Study on Frequency Stability of Micromechanical Resonators Operating in the Nonlinear Tapping Mode,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020. (Best Oral Paper Award)
S.-Y. Liu and W.-C. Li, “Contour-Plot Design Methodology for MEMS Capacitive Accelerometers,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020. (Excellent Poster Paper Award)
Y. Yi and W.-C. Li, “Bias-Voltage Reduction of CMOS-MEMS Resoswitches via Substrate Biasing,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020. (Best Poster Paper Award)
C.-E. Hsu and W.-C. Li, “Wet-Release Yield Improvement of CMOS-MEMS Metal Resonators via Diffusion Control,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020.
H.-W. Wang and W.-C. Li, “Q-Factor Enhancement and Frequency Trimming of Comb-Driven Folded-Beam Micromechanical Resonators Using Atmosphere-Pressure Plasma Jet,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020.
Y.-S. Lin, P.-Z. Chang, and W.-C. Li, “Process Integration of Piezoelectric Force Sensors for Real-Time Turning Tool Cutting Force Monitoring,” in the ICSS 2020 International Conference on Smart Sensors (暨第25屆台灣化學感測器科技研討會/第23屆微奈米系統工程研討會), NSYSU, Kaohsiung, Oct. 19-20, 2020.
J.-R. Liu and W.-C. Li, “Theoretical modeling of a temperature-insensitive CMOS-MEMS free-free beam resonator,” in the 21st Nano Engineering and Microsystem Technology Conference (第21屆奈米工程暨微系統技術研討會), Shenkeng, Taipei, Jun. 1-2, 2018. (壁報佳作獎)
C.-P. Tsai, W.-R. Du, and W.-C. Li, “Nonlinear contact dynamics modeling for comb-driven folded-beam micromechanical resoswitches,” in the 21st Nano Engineering and Microsystem Technology Conference (第21屆奈米工程暨微系統技術研討會), Shenkeng, Taipei, Jun. 1-2, 2018. (最佳論文獎)
J.-R. Liu, S.-C. Lu, C.-P. Tsai, and W.-C. Li, “CMOS-MEMS-based arrayed-CC-Beam displacement amplifiers,” in the 3rd Association of Computational Mechanics Taiwan (ACMT) Conference (第3屆台灣計算力學會議), Tainan, Oct. 19-20, 2017.

Prior to 2017

W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “A micromechanical high-Q elliptic disk displacement amplifier,” in the 29th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’16), Shanghai, China, Jan. 24-28, 2016.
R. Liu, J. Naghsh Nilchi, W.-C. Li, and C. T.-C. Nguyen, “Soft-impacting micromechanical resoswitch zero-quiescent power AM receiver,” in the 29th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’16), Shanghai, China, Jan. 24-28, 2016.
W.-C. Li, Y. Lin, and C. T.-C. Nguyen, “Metal micromechanical filter-power amplifier utilizing a displacement-amplifying resonant switch,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 2469-2472.
Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, D. G. Senesky, and A. P. Pisano, “MEMS piezoelectric energy harvesters for harsh environment sensing,” in Proc. the 9th Intl. Workshop on Structural Health Monitoring (IWSHM’13), Stanford, CA, Sep. 10-12, 2013, pp. 2275-2282. (Invited)
Y. Lin, R. Liu, W.-C. Li, M. Akgul, and C. T.-C. Nguyen, “A micromechanical resonant charge pump,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 1727-1730. (Best Paper Award Winner)
Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, and A. P. Pisano, “High-temperature stable piezoelectric aluminum nitride energy harvesters utilizing elastically supported diaphragms,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 2268-2271. (Best Poster Award Winner)
Y. Lin, W.-C. Li, and C. T.-C. Nguyen, “A MEMS-based charge pump,” in Tech. Dig. 2013 Symp. on VLSI Technology (VLSIT’13), Kyoto, Japan, Jun. 11-13, 2013, pp. T148-149.
L. Wu, M. Akgul, W.-C. Li, Y. Lin, Z. Ren, T. O. Rocheleau, C. T.-C. Nguyen, “Micromechanical disk array for enhanced frequency stability against bias voltage fluctuations,” in Proc. 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFCS), Prague, Czech Republic, Jul. 21-25, 2013, pp. 547 – 550.
Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, D. G. Senesky, and A. P. Pisano, “SiC/AlN piezoelectric energy harvesters for pulsed pressure sources in harsh environment applications,” in Tech. Dig. 2012 Solid-State Sensor, Actuator, and Microsystems Workshop (Hilton Head’12), Hilton Head, SC, Jun. 3-7, 2012, pp. 505-508.
Y. Lin, T. Riekkinen, W.-C. Li, E. Alon, and C. T.-C. Nguyen, “A metal micromechanical resonant switch for on-chip power applications,” in Tech. Digest 2012 IEEE Int. Electron Devices Mtg. (IEDM’11), Washington, DC, Dec. 5-7, 2011, pp. 162-165.
L. Wu, M. Akgul, Z. Ren, Y. Lin, W.-C. Li, and C. T.-C. Nguyen, “Hollow stems for higher micromechanical disk resonator quality factor,” in Proc. 2011 IEEE Int. Ultrasonics Symposium (IUS’11), Orlando, FL, Oct. 18-21, 2011, pp. 1964-1967.
W.-C. Li, Y. Jiang, R. A. Schneider, H. G. Barrow, L. Lin, and C.T.-C. Nguyen, “Polysilicon-filled carbon nanotube grass structural material for micromechanical resonators,” in Tech. Dig. 24th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’11), Cancun, Mexico, Jan. 23-27, 2011, pp. 477-480.
B. Kim, M. Akgul, Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators,” in Proc. 2010 IEEE Int. Frequency Control Symp. (FCS’10), Newport Beach, CA, Jun. 1-4, 2010, pp. 273-278.
W.-C. Li, Y. Lin, B. Kim, Z. Ren, and C. T.-C. Nguyen, “Quality factor enhancement in micromechanical resonators at cryogenic temperatures,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 1445-1448.
M. Akgul, B. Kim, L.-W. Hung, Y. Lin, W.-C. Li, W.-L. Huang, I. Gurin, A. Borna, and C. T.-C. Nguyen, “Oscillator far-from-carrier phase noise reduction via nano-scale gap tuning of micromechanical resonators,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 798-801.
Y. Lin, W.-C. Li, I. Gurin, S.-S. Li, Y.-W. Lin, Z. Ren, B. Kim, and C. T.-C. Nguyen, “Digitally-specified micromechanical displacement amplifiers,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 781-784.
Y. Lin, W.-C. Li, B. Kim, Y.-W. Lin, Z. Ren, and C. T.-C. Nguyen, “Enhancement of micromechanical resonator manufacturing precision via mechanically-coupled arraying,” in Proc. 2009 IEEE Int. Frequency Control Symp. (FCS’09), Besancon, France, Apr. 20-24, 2009, pp. 58-63.
B. Kim, Y. Lin, W.-L. Huang, M. Akgul, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “Micromechanical resonant displacement gain stages,” in Tech. Dig. 22nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’09), Sorrento, Italy, Jan. 25-29, 2009, pp. 19-22.
Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “The micromechanical resonant switch (“Resoswitch”),” in Tech. Dig. 2008 Solid-State Sensor, Actuator, and Microsystems Workshop (Hilton Head’08), Hilton Head, SC, Jun. 1-5, 2008, pp. 40-43.
Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “A resonance dynamical approach to faster, more reliable micromechanical switches,” in Proc. 2008 IEEE Int. Frequency Control Symp. (FCS’08), Honolulu, Hawaii, May 19-21, 2008, pp. 640-645.
J.-L Cheng, C.-S. Wang, W.-C. Li, and C.-K. Wang, “A 1.1-V CMOS frequency synthesizer with pass-transistor-logic prescaler for U-NII band system,” in Proc. 2008 Int. Symp. on VLSI Design Automation and Test (VLSI-DAT’08), Hsinchu, Taiwan, Apr. 23-25, 2008, pp. 117-120.
C.-S. Wang, W.-C. Li, C.-K. Wang, H.-Y. Shih, and T.-Y. Yang, “A 3–10 GHz full-band single VCO agile switching frequency generator for MB-OFDM UWB,” in Proc. 2007 IEEE Asian Solid-State Circuits Conference (ASSCC’07), Jeju, Korea, Nov. 12-14, 2007, pp. 75-78.
W.-C. Li, C.-S. Wang, and C.-K. Wang, “A 2.4-GHz/3.5-GHz/5-GHz multi-band LNA with complementary switched capacitor multi-tap inductor in 0.18 μm CMOS,” in Proc. 2006 Int. Symp. on VLSI Design Automation and Test (VLSI-DAT’06), Hsinchu, Taiwan, Apr. 26-28, 2006, pp. 1-4.
W.-C. Li, C.-S. Wang, and C.-K. Wang, “A multi-band CMOS LNA using complimentary switched capacitor multi-tap inductor for WMAN and WLAN applications,” in 2005 IEEJ Int. Analog VLSI Workshop, Oct. 19-21, 2005.
C.-S. Wang, W.-C. Li, and C.-K. Wang, “A multi-band multi-standard RF front-end for IEEE 802.16a and IEEE 802.11a/b/g applications,” in Proc. IEEE Int. Symp. on Circuits and Systems (ISCAS’05), Kobe, Japan, May 23-26, 2005, pp. 3974-3977.

Patents

W.-C. Li, C.-P. Tsai, H.-W. Wang, “Device and method for monitoring surface condition of contact surface of detected object,” US Patent Application, 17/113,109, Dec. 7th, 2020.
C. T.-C. Nguyen, W.-C. Li, R. Liu, “Zero-quiescent power receiver,” US10257002 B2, April 9th, 2019.
C. T.-C. Nguyen, Y. Lin, W.-C. Li, B. Kim, “Microelectromechanical system (MEMS) resonant switches and applications for power converters and amplifiers,” US9077060 B2, Jul. 7th, 2015.