Publications

2018
  • S.-C. Lu, W.-R. Du, Y.-C. Huang, C.-P. Tsai, and W.-C. Li, “MEMS surface coating condition monitoring via nonlinear tapping of resoswitches,” in 2018 IEEE Frequency Control Symposium (IFCS’18), Olympic Valley, CA, May 21-24, 2018. (Student Best Paper Finalist)
  • J.-R. Liu, S.-C. Lu, C.-P. Tsai, and W.-C. Li, “A CMOS-MEMS clamped–clamped beam displacement amplifier for resonant switch applications,” J. Micromech. Microeng. (JMM), vol. 28, no. 6, pp. 065001, Mar. 2018.
  • S.-C. Lu, C.-P. Tsai, and W.-C. Li, “A CMOS-MEMS CC-beam metal resoswitch for zero quiescent power receiver applications,” in the 31st IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’18), Belfast, North Ireland, UK, Jan. 21-25, 2018, pp. 801-804.

Domestic Conference
  • J.-R. Liu and W.-C. Li, “Theoretical modeling of a temperature-insensitive CMOS-MEMS free-free beam resonator,” in the 21st Nano Engineering and Microsystem Technology Conference (第21屆奈米工程暨微系統技術研討會), Taipei, Jun. 1-2, 2018. (Honorable Mention Award)
  • C.-P. Tsai, W.-R. Du, and W.-C. Li, “Nonlinear contact dynamics modeling for comb-driven folded-beam micromechanical resoswitches,” in the 21st Nano Engineering and Microsystem Technology Conference (第21屆奈米工程暨微系統技術研討會), Taipei, Jun. 1-2, 2018. (Best Conference Paper Award Winner)
  • J.-R. Liu, S.-C. Lu, C.-P. Tsai, and W.-C. Li, “CMOS-MEMS-based arrayed-CC-Beam displacement amplifiers,” in the 3rd Association of Computational Mechanics Taiwan (ACMT) Conference (第3屆台灣計算力學會議), Tainan, Oct. 19-20, 2017.

Prior to 2017
  • W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “A micromechanical high-Q elliptic disk displacement amplifier,” in the 29th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’16), Shanghai, China, Jan. 24-28, 2016.
  • R. Liu, J. Naghsh Nilchi, W.-C. Li, and C. T.-C. Nguyen, “Soft-impacting micromechanical resoswitch zero-quiescent power AM receiver,” in the 29th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’16), Shanghai, China, Jan. 24-28, 2016.
  • W.-C. Li, Y. Lin, and C. T.-C. Nguyen, “Metal micromechanical filter-power amplifier utilizing a displacement-amplifying resonant switch,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 2469-2472.
  • Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, D. G. Senesky, and A. P. Pisano, “MEMS piezoelectric energy harvesters for harsh environment sensing,” in Proc. the 9th Intl. Workshop on Structural Health Monitoring (IWSHM’13), Stanford, CA, Sep. 10-12, 2013, pp. 2275-2282. (Invited)
  • Y. Lin, R. Liu, W.-C. Li, M. Akgul, and C. T.-C. Nguyen, “A micromechanical resonant charge pump,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 1727-1730. (Best Paper Award Winner)
  • Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, and A. P. Pisano, “High-temperature stable piezoelectric aluminum nitride energy harvesters utilizing elastically supported diaphragms,” in the 17th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’13), Barcelona, Spain, Jun. 16-20, 2013, pp. 2268-2271. (Best Poster Award Winner)
  • Y. Lin, W.-C. Li, and C. T.-C. Nguyen, “A MEMS-based charge pump,” in Tech. Dig. 2013 Symp. on VLSI Technology (VLSIT’13), Kyoto, Japan, Jun. 11-13, 2013, pp. T148-149.
  • L. Wu, M. Akgul, W.-C. Li, Y. Lin, Z. Ren, T. O. Rocheleau, C. T.-C. Nguyen, “Micromechanical disk array for enhanced frequency stability against bias voltage fluctuations,” in Proc. 2013 Joint European Frequency and Time Forum & International Frequency Control Symposium (EFTF/IFCS), Prague, Czech Republic, Jul. 21-25, 2013, pp. 547 – 550.
  • Y.-J. Lai, W.-C. Li, C.-M. Lin, V. V. Felmetsger, D. G. Senesky, and A. P. Pisano, “SiC/AlN piezoelectric energy harvesters for pulsed pressure sources in harsh environment applications,” in Tech. Dig. 2012 Solid-State Sensor, Actuator, and Microsystems Workshop (Hilton Head’12), Hilton Head, SC, Jun. 3-7, 2012, pp. 505-508.
  • Y. Lin, T. Riekkinen, W.-C. Li, E. Alon, and C. T.-C. Nguyen, “A metal micromechanical resonant switch for on-chip power applications,” in Tech. Digest 2012 IEEE Int. Electron Devices Mtg. (IEDM’11), Washington, DC, Dec. 5-7, 2011, pp. 162-165.
  • L. Wu, M. Akgul, Z. Ren, Y. Lin, W.-C. Li, and C. T.-C. Nguyen, “Hollow stems for higher micromechanical disk resonator quality factor,” in Proc. 2011 IEEE Int. Ultrasonics Symposium (IUS’11), Orlando, FL, Oct. 18-21, 2011, pp. 1964-1967.
  • W.-C. Li, Y. Jiang, R. A. Schneider, H. G. Barrow, L. Lin, and C.T.-C. Nguyen, “Polysilicon-filled carbon nanotube grass structural material for micromechanical resonators,” in Tech. Dig. 24th IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’11), Cancun, Mexico, Jan. 23-27, 2011, pp. 477-480.
  • B. Kim, M. Akgul, Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “Acceleration sensitivity of small-gap capacitive micromechanical resonator oscillators,” in Proc. 2010 IEEE Int. Frequency Control Symp. (FCS’10), Newport Beach, CA, Jun. 1-4, 2010, pp. 273-278.
  • W.-C. Li, Y. Lin, B. Kim, Z. Ren, and C. T.-C. Nguyen, “Quality factor enhancement in micromechanical resonators at cryogenic temperatures,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 1445-1448.
  • M. Akgul, B. Kim, L.-W. Hung, Y. Lin, W.-C. Li, W.-L. Huang, I. Gurin, A. Borna, and C. T.-C. Nguyen, “Oscillator far-from-carrier phase noise reduction via nano-scale gap tuning of micromechanical resonators,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 798-801.
  • Y. Lin, W.-C. Li, I. Gurin, S.-S. Li, Y.-W. Lin, Z. Ren, B. Kim, and C. T.-C. Nguyen, “Digitally-specified micromechanical displacement amplifiers,” in the 15th Int. Conf. on Solid-State Sensors, Actuators, & Microsystems (TRANSDUCERS’09), Denver, CO, Jun. 21-25, 2009, pp. 781-784.
  • Y. Lin, W.-C. Li, B. Kim, Y.-W. Lin, Z. Ren, and C. T.-C. Nguyen, “Enhancement of micromechanical resonator manufacturing precision via mechanically-coupled arraying,” in Proc. 2009 IEEE Int. Frequency Control Symp. (FCS’09), Besancon, France, Apr. 20-24, 2009, pp. 58-63.
  • B. Kim, Y. Lin, W.-L. Huang, M. Akgul, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “Micromechanical resonant displacement gain stages,” in Tech. Dig. 22nd IEEE Int. Conf. on Micro Electro Mechanical Systems (MEMS’09), Sorrento, Italy, Jan. 25-29, 2009, pp. 19-22.
  • Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “The micromechanical resonant switch (“Resoswitch”),” in Tech. Dig. 2008 Solid-State Sensor, Actuator, and Microsystems Workshop (Hilton Head’08), Hilton Head, SC, Jun. 1-5, 2008, pp. 40-43.
  • Y. Lin, W.-C. Li, Z. Ren, and C. T.-C. Nguyen, “A resonance dynamical approach to faster, more reliable micromechanical switches,” in Proc. 2008 IEEE Int. Frequency Control Symp. (FCS’08), Honolulu, Hawaii, May 19-21, 2008, pp. 640-645.
  • J.-L Cheng, C.-S. Wang, W.-C. Li, and C.-K. Wang, “A 1.1-V CMOS frequency synthesizer with pass-transistor-logic prescaler for U-NII band system,” in Proc. 2008 Int. Symp. on VLSI Design Automation and Test (VLSI-DAT’08), Hsinchu, Taiwan, Apr. 23-25, 2008, pp. 117-120.
  • C.-S. Wang, W.-C. Li, C.-K. Wang, H.-Y. Shih, and T.-Y. Yang, “A 3–10 GHz full-band single VCO agile switching frequency generator for MB-OFDM UWB,” in Proc. 2007 IEEE Asian Solid-State Circuits Conference (ASSCC’07), Jeju, Korea, Nov. 12-14, 2007, pp. 75-78.
  • W.-C. Li, C.-S. Wang, and C.-K. Wang, “A 2.4-GHz/3.5-GHz/5-GHz multi-band LNA with complementary switched capacitor multi-tap inductor in 0.18 μm CMOS,” in Proc. 2006 Int. Symp. on VLSI Design Automation and Test (VLSI-DAT’06), Hsinchu, Taiwan, Apr. 26-28, 2006, pp. 1-4.
  • W.-C. Li, C.-S. Wang, and C.-K. Wang, “A multi-band CMOS LNA using complimentary switched capacitor multi-tap inductor for WMAN and WLAN applications,” in 2005 IEEJ Int. Analog VLSI Workshop, Oct. 19-21, 2005.
  • C.-S. Wang, W.-C. Li, and C.-K. Wang, “A multi-band multi-standard RF front-end for IEEE 802.16a and IEEE 802.11a/b/g applications,” in Proc. IEEE Int. Symp. on Circuits and Systems (ISCAS’05), Kobe, Japan, May 23-26, 2005, pp. 3974-3977.

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